Webinars

Scaling AI with Chiplet-Based Systems

17 April 2026 at 12:30pm ET | Virtual Event

In the rapidly evolving landscape of artificial intelligence, chiplets are emerging as a transformative technology, paving the way for the next generation of AI systems. Chiplets permit the integration of more processing power within a single package and allow for new connectivity solutions so that thousands of AI accelerators can work as a cohesive unit. Optical connectivity, facilitated by chiplets, offers high-speed data transmission with lower power consumption, crucial for handling the massive data loads in AI applications. The emerging chiplet ecosystem, underwritten by high-performance die-to-die interfaces, is throwing open the doors of innovation and facilitating the next wave of AI scaling.

Guest Speaker:

Dr. Tony Chan Carusone has taught and researched integrated circuits and systems for high-speed connectivity in industry and academia for over 20 years. He has been the Chief Technology Officer of Alphawave Semi since 2022 and a faculty member at the University of Toronto since completing his Ph.D. there in 2002. He has received eleven best-paper awards at leading conferences for work on chip-to-chip and optical communication circuits, analog-to-digital conversion, and precise clock generation. He co-authored the latest editions of the classic textbooks “Analog Integrated Circuit Design” and “Microelectronic Circuits,” the best-selling engineering textbook ever. He is a Fellow of the IEEE.

This webinar is organized by the IEEE AI Hardware & Infrastructure Working Group.